This equipment is specifically designed for the semiconductor industry, focusing on the precision cleaning needs of wafer silicon wafers. Modeled as JTW-90360AD, it adopts an integrated design of "ultrasonic rotational cleaning + oscillation + hot air drying", which is suitable for fully automatic cleaning and drying operations of wafer silicon wafers in semiconductor production, and meets the industry's high-standard requirements for silicon wafer cleanliness and dryness.

The equipment’s cleaning frequency ranges from 40KHz to 80KHz (adjustable), allowing flexible frequency matching according to different types of stains on the surface of wafer silicon wafers (such as fine particles and organic residues). Through the synergistic effect of ultrasonic vibration, rotation, and oscillation, it deeply removes impurities from the surface and gaps of silicon wafers. The cleaning temperature can be adjusted from room temperature to 100℃, which can adapt to different cleaning process requirements and avoid silicon wafer damage caused by high temperatures or incomplete cleaning due to low temperatures.