Tailored for cleaning wafer-carrying fixtures, coating fixtures, and photolithography fixtures in the semiconductor industry, this machine is equipped with adjustable high-frequency ultrasonic waves (28KHz-40KHz), which can precisely remove photoresist residues, metal ions, and micron-level dust from the surface and gaps of the fixtures. The three-tank staged cleaning further ensures no secondary pollution.

The cleaning temperature is adjustable from room temperature to 100℃: low temperatures are suitable for fixtures made of sensitive materials, while high temperatures efficiently dissolve stubborn stains—fully meeting the "high precision and no impurities" cleaning standards of the semiconductor industry! With an overall dimension of 4300×2500×2700mm (note: the dimension symbol is corrected to the standard "×" for clarity), it fits well into the layout of semiconductor workshop production lines. The 3-ton industrial-grade body is stable and durable, supporting 24-hour continuous operation, and helps avoid the problem of reduced wafer yield caused by substandard fixture cleaning!